Low temperature Au-Au bonding with VUV/O3 treatment

Author

Okada, Akiko ; Nimura, Masatsugu ; Unami, Naoko ; Shigetou, Akitsu ; Noma, Hirokazu ; Sakuma, Katsuyuki ; Mizuno, Jun ; Shoji, Shuichi

Author_Institution

Waseda Univ., Tokyo, Japan

fYear

2012

fDate

Jan. 31 2012-Feb. 2 2012

Firstpage

1

Lastpage

5

Abstract

This paper describes low temperature Au-Au bonding with vacuum ultraviolet (VUV) irradiation in the presence of oxygen gas. The VUV/O₃ treatment can remove organic contaminants of Au surfaces without damages. The Au surfaces after the VUV/O₃ treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The results show that carbon-based contaminants were dramatically decreased and that there were no serious damages in Au surfaces by the VUV/O₃ treatment. The Au-Au bonding with VUV/O₃ treatment was achieved at 200 °C. The average of shear strength of about 80 MPa per unit area was obtained. Therefore, it was proved that VUV/O₃ treatment is effective in Au-Au bonding.

Keywords

X-ray photoelectron spectra; atomic force microscopy; gold; integrated circuit bonding; shear strength; surface treatment; ultraviolet radiation effects; AFM; Au-Au; VUV-O₃ treatment; X-ray photoelectron spectroscopy; XPS; atomic force microscopy; carbon-based contaminants; low temperature bonding; organic contaminants; oxygen gas; shear strength; temperature 200 degC; vacuum ultraviolet irradiation; Bonding; Gold; Optical surface waves; Rough surfaces; Surface contamination; Surface roughness; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

3D Systems Integration Conference (3DIC), 2011 IEEE International

Conference_Location

Osaka

Print_ISBN

978-1-4673-2189-1

Type

conf

DOI

10.1109/3DIC.2012.6263015

Filename

6263015