• DocumentCode
    569850
  • Title

    A “Universal” life-test system for electromechanical relays

  • Author

    Frost, B.J. ; Hobday, S.J.

  • Author_Institution
    Appl. Relay Testing Ltd., Wimborne, UK
  • fYear
    2012
  • fDate
    14-17 May 2012
  • Firstpage
    110
  • Lastpage
    115
  • Abstract
    The field of Electrical Contact Switching brings together physics, material technology and accumulated experience and remains a very analogue science. Real-world monitoring of contact switching is vital in determining the best materials and construction for a relay device and to ensure quality in today´s demanding market place. Although it is simple in principle to cycle a relay with a specific contact load and observe total failure, designers today require much more insight into trends allowing them to better predict failures in contact use, in application areas that have not been fully tested. Applied Relay Testing has been performing research and development into a `universal life test system´ which would provide information about contact voltage and current, contact timing and device operate / release voltage actually DURING the lifetest, showing each of these parameters in a graphical form and allowing their trends to be observed. This paper will describe the measurement techniques involved and the results obtained, illustrating how this test system brings a unique insight into the life-time of the modern electromechanical relay.
  • Keywords
    contact resistance; electrical contacts; failure analysis; life testing; relays; applied relay testing; contact current; contact resistance; contact timing; contact voltage; electrical contact switching; electromechanical relays; failure prediction; measurement techniques; relay device; specific contact load; universal life-test system; Contact Resistance; Contact Timing; Electromechanical Relays; Life-Test; Operate/Release Voltage;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Electrical Contacts (ICEC 2012), 26th International Conference on
  • Conference_Location
    Beijing
  • Electronic_ISBN
    978-1-84919-508-9
  • Type

    conf

  • DOI
    10.1049/cp.2012.0632
  • Filename
    6301877