• DocumentCode
    576684
  • Title

    From the future to the mainstream, has GaAs reliability finally come of age?

  • Author

    Roesch, William J.

  • Author_Institution
    TriQuint Semicond., Inc., Hillsboro, OR, USA
  • fYear
    2012
  • fDate
    Sept. 30 2012-Oct. 3 2012
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    Compound semiconductor circuits are flourishing in high volume production which has been expected and predicted for several years. As these GaAs circuits become more widely considered for use in applications of various electronic systems, instruments, and devices, questions regarding reliability arise.
  • Keywords
    III-V semiconductors; gallium arsenide; semiconductor device reliability; GaAs; Gallium arsenide; Integrated circuit reliability; Metallization; Silicon; GaAs; HBT; RF circuits; building-in; continuous improvement; design influence; device physics; failure mechanisms; pHEMT; reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2012 IEEE
  • Conference_Location
    Portland, OR
  • ISSN
    1088-9299
  • Print_ISBN
    978-1-4673-3020-6
  • Type

    conf

  • DOI
    10.1109/BCTM.2012.6352645
  • Filename
    6352645