DocumentCode
578961
Title
Virtual model optimization and locomotion control of bionic hexapod robot
Author
Zhang, Jing ; Wang, Jianhua ; Chen, Weihai ; Chen, Wenjie
Author_Institution
Sch. of Autom. Sci. & Electr. Eng., Beijing Univ. of Aeronaut. & Astronaut., Beijing, China
fYear
2012
fDate
18-20 July 2012
Firstpage
497
Lastpage
501
Abstract
With reference to current biology research achievements of hexapod insects, this paper presents the design and optimization of structure of the bionic hexapod robot, imitating the cockroach body shape and structure features. Tripod Gaits is chosen as the robot´s gait which is the most stable and fast gait for hexapod robots. We evaluate the performance of our design by testing it on the simulation system based on Virtools, which is an interactive integrating platform for virtual prototype and virtual environment. As a result of the adoption of the software, this paper relates in detail the message passing mechanism and a method of adjusting torque factor dynamic parameters, based on actuator´s movement need. The result verifies the rationality of the structure and the locomotion flexibility of the robot.
Keywords
control engineering computing; legged locomotion; message passing; motion control; optimisation; performance evaluation; robot dynamics; virtual prototyping; virtual reality; Virtools; actuator movement need; biology research achievements; bionic hexapod robot; cockroach body shape; hexapod insects; interactive integrating platform; locomotion control; message passing mechanism; performance evaluation; robot gait; robot locomotion flexibility; simulation system; software adoption; structure features; torque factor dynamic parameters; tripod gaits; virtual environment; virtual model optimization; virtual prototype; Biology; Gears; Legged locomotion; Optimization; Servomotors; Torque; Bionic hexapod robot; mechanism optimization; simulation system; tripod gaits;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics and Applications (ICIEA), 2012 7th IEEE Conference on
Conference_Location
Singapore
Print_ISBN
978-1-4577-2118-2
Type
conf
DOI
10.1109/ICIEA.2012.6360779
Filename
6360779
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