DocumentCode
581421
Title
Model-based framework for embedded system product line
Author
Hoyos, Horacio ; Casallas, Rubby ; Jimenez, Fernando
Author_Institution
Sch. of Eng., Univ. de Los Andes, Bogota, Colombia
fYear
2012
fDate
25-28 Oct. 2012
Firstpage
3101
Lastpage
3106
Abstract
The use of reconfigurable platforms for embedded system design leverages product line engineering (PLE), in which the development of products starts from a set of core assets (the platform) rather than the development of individual products from zero. Two major activities of PLE are domain engineering (i.e., platform development) and product engineering (i.e., product customization) reusing the core assets. Virtual prototyping in PLE allows rapid validation of both the platform and individual products with greater benefits in development costs, time to market and quality. However, since virtual prototypes (VP) are implemented in low-level languages, if platform development and product engineering are done at this level, productivity is negatively affected. A commonly-accepted solution for closing this productivity gap is to raise the level of abstraction in the whole design process and to automate the implementation of VPs from the high-level descriptions. In this paper, we present the HiLeS2 Framework, which is based on Model Driven Software Product Lines (MD-SPL) concepts. HiLeS2 framework provides an environment for domain and product engineering, automated construction of VPs and creation of product line integrated development environments.
Keywords
embedded systems; high level languages; software cost estimation; software development management; virtual prototyping; HiLeS2 framework; MD-SPL; PLE; design process; domain engineering; embedded system design; embedded system product line; high-level descriptions; low-level languages; model driven software product lines; model-based framework; product development costs; product engineering; product line engineering; product line integrated development environment; product quality; productivity gap; reconfigurable platforms; time to market; virtual prototypes; virtual prototyping; Delay; Educational institutions; Feature extraction; Hardware design languages; Sugar; Unified modeling language;
fLanguage
English
Publisher
ieee
Conference_Titel
IECON 2012 - 38th Annual Conference on IEEE Industrial Electronics Society
Conference_Location
Montreal, QC
ISSN
1553-572X
Print_ISBN
978-1-4673-2419-9
Electronic_ISBN
1553-572X
Type
conf
DOI
10.1109/IECON.2012.6389403
Filename
6389403
Link To Document