Co-analysis of signal and power integrity of 3D stacked package using flexible printed circuits

Author

Ikemiya, Keisuke ; Kanazawa, Masato ; Sudo, Toshio ; Masuda, Shizuaki ; Hirakawa, Yasushi ; Wada, Kikuo

Author_Institution

Shibaura-Inst. of Technol., Tokyo, Japan

fYear

2012

fDate

17-21 Sept. 2012

Firstpage

1

Lastpage

4

Abstract

Three dimensionally stacked package using FFCSP (Flexible carrier Folded real Chip Size Package) has been developed as one solution of high-density DRAM module. FPC (Flexible printed circuit) was effectively utilized to construct the pads at the both top and bottom sides of PoP (package-on-package) structure. In such multi-tiered package structures, the power supply stability for the upper tiered package is estimated to be worse than that of the lower tiered package due to parasitic inductance. In this paper, the co-analysis model including signal integrity (SI) and power integrity (PI) has been established to evaluate the power supply and signal quality among the multi-tiered chips. In particular, the power distribution networks (PDN) and eye diagrams for multi-tiered package were discussed.

Keywords

DRAM chips; flexible electronics; integrated circuit packaging; power supply circuits; printed circuits; three-dimensional integrated circuits; 3D stacked package; FFCSP; FPC; PoP structure; coanalysis model; eye diagrams; flexible carrier folded real chip size package; flexible printed circuits; high-density DRAM module; lower tiered package; multitiered chips; multitiered package structures; package-on-package structure; parasitic inductance; power integrity; power supply stability; signal co-analysis; signal integrity; signal quality; three dimensionally stacked package; upper tiered package; DRAM chips; Impedance; Integrated circuit modeling; Noise; Power supplies; Solid modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility (EMC EUROPE), 2012 International Symposium on

Conference_Location

Rome

ISSN

2325-0356

Print_ISBN

978-1-4673-0718-5

Type

conf

DOI

10.1109/EMCEurope.2012.6396881

Filename

6396881