• DocumentCode
    586861
  • Title

    On efficient silicon debug with flexible trace interconnection fabric

  • Author

    Xiao Liu ; Qiang Xu

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Hong Kong, China
  • fYear
    2012
  • fDate
    5-8 Nov. 2012
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    Trace-based debug solutions facilitate to eliminate bugs escaped from pre-silicon verification and have gained wide acceptance in the industry. Generally speaking, a number of “key” signals in the circuit are tapped, but not all of them can be observed at the same time due to the limited trace bandwidth. Therefore, a trace interconnection fabric is utilized to output either a subset of signals with multiplexor (MUX) network or compressed signatures with XOR network to the trace memory/port in each debug run. However, both kinds of trace interconnection fabrics have limitations. On one hand, with MUX-based fabric, the visibility of the circuit is limited and it requires many debug runs to locate errors. On the other hand, with XOR-based fabric, typically clean “golden vectors” (i.e, without unknown bits) are required so that signatures are not corrupted. In this paper, we propose a flexible trace interconnection fabric design that is able to overcome the above limitations, at the cost of little extra design-for-debug hardware. Experimental results on benchmark circuits demonstrate the effectiveness of the proposed technique.
  • Keywords
    benchmark testing; flexible electronics; integrated circuit design; integrated circuit interconnections; logic gates; multiplexing equipment; MUX network; MUX-based fabric; XOR network; XOR-based fabric; benchmark circuits; bug elimination; compressed signatures; design-for-debug hardware; flexible trace interconnection fabric design; golden vectors; multiplexor network; presilicon verification; silicon debug; trace bandwidth; trace memory; trace port; trace-based debug solutions; Compaction; Computer bugs; Fabrics; Hardware; Integrated circuit interconnections; Silicon; Vectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference (ITC), 2012 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4673-1594-4
  • Type

    conf

  • DOI
    10.1109/TEST.2012.6401539
  • Filename
    6401539