• DocumentCode
    588137
  • Title

    28nm FDSOI offer for academia and industry

  • Author

    Torki, Kholdoun

  • Author_Institution
    CMP, Grenoble, France
  • fYear
    2012
  • fDate
    1-4 Oct. 2012
  • Firstpage
    1
  • Lastpage
    25
  • Abstract
    The presentations of slides covers the following topics: CMP process; FDSOI; design kits; and standard cells library.
  • Keywords
    chemical mechanical polishing; integrated circuit design; silicon-on-insulator; CMP process; FDSOI; design kits; size 28 nm; standard cells library; Conferences; Educational institutions; Industries; Joining processes; Libraries; Prototypes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference (SOI), 2012 IEEE International
  • Conference_Location
    NAPA, CA
  • ISSN
    1078-621X
  • Print_ISBN
    978-1-4673-2690-2
  • Electronic_ISBN
    1078-621X
  • Type

    conf

  • DOI
    10.1109/SOI.2012.6404351
  • Filename
    6404351
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=588137