• DocumentCode
    590541
  • Title

    Thermal flow sensors on flexible substrates for minimally invasive medical instruments

  • Author

    Mimoun, B. ; van der Horst, Arjen ; Dekker, Ronald ; van der Voort, Dennis ; Rutten, Marcel ; van de Vosse, Frans ; Dekker, Ronald

  • Author_Institution
    ECTM, Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2012
  • fDate
    28-31 Oct. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We present a flexible polyimide-based calorimetric thermal flow sensor featuring two thermopiles and a heating element perpendicular to the flow direction, connected to a rigid silicon chip containing the bondpads for standard wire bonding. After measurement of the temperature coefficient of resistance of the heater (TCR) and the Seebeck coefficient of the thermopiles of the sensor, the devices are mounted on a printed circuit board (PCB) flow channel and tested in constant power (CP) mode under both steady and dynamic flow conditions. The obtained results are in good agreement with previous research on similar, less flexible, flow sensors. The presented device can then potentially be wrapped around catheters or guidewires for intravascular blood flow assessment.
  • Keywords
    Seebeck effect; biomedical equipment; blood flow measurement; cardiovascular system; channel flow; flow sensors; heating elements; lead bonding; printed circuits; surgery; temperature measurement; thermopiles; CP mode; PCB flow channel; Seebeck coefficient; bondpads; constant power mode; dynamic flow condition; flexible polyimide-based calorimetry; flexible substrate; heating element; intravascular blood flow assessment; minimally invasive medical instrument; printed circuit board; resistance of the heater; standard wire bonding; steady flow condition; temperature coefficient measurement; thermal flow sensor; thermopiles; Fluid flow measurement; Heating; Sensor phenomena and characterization; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2012 IEEE
  • Conference_Location
    Taipei
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4577-1766-6
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2012.6411429
  • Filename
    6411429