• DocumentCode
    590548
  • Title

    Thin-film-based thermoelectric energy generator device with a card structure

  • Author

    Xiao Yu ; Yanxiang Liu ; Tie Li ; Hong Zhou ; Xiuli Gao ; Fei Feng ; Yuelin Wang

  • Author_Institution
    State Key Lab. of Transducer Technol. & the Sci. & Technol. on Micro-Syst. Lab., Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China
  • fYear
    2012
  • fDate
    28-31 Oct. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This work presents a thermoelectric energy generator (TEG) device with a card structure which embeds a thin-film based TEG chip. The thermocouples are densely arranged between comb-shaped substrates in the chip. The chip is packaged vertically and heated/cooled by metallic plugs connected with the external heat source and heat sink. The packaged device has a footprint of 3 mm × 1.2 mm, while the height can be flexibly scaled by changing the dimensions of the metallic plugs, which indicates a potential use in the high density electronic devices. The n/p poly-silicon is employed as the thermoelectric material for the early-stage research of the new TEG structure. The measured open-circuit voltage for each TEG card reaches 110 mV·K-1. Being worn on human body, the output power on a matched external load reached 0.13 μW for 3 cards in parallel, which improves more than two orders of magnitude than traditional in-plane packaged TEG device with poly-silicon thermal legs.
  • Keywords
    elemental semiconductors; heat sinks; silicon; thermocouples; thin films; Si; card structure; comb-shaped substrates; external heat source; heat sink; high density electronic devices; metallic plugs; packaged device; polysilicon thermal legs; thermocouples; thermoelectric material; thin-film-based thermoelectric energy generator; Copper; Generators; Heat sinks; Materials; Power generation; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2012 IEEE
  • Conference_Location
    Taipei
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4577-1766-6
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2012.6411445
  • Filename
    6411445