• DocumentCode
    591699
  • Title

    Effect of PEG on impact strength of PLA hybrid biocomposite

  • Author

    Anuar, H. ; Azlina, H.N. ; Suzana, A.B.K. ; Kaiser, M.R. ; Bonnia, N.N. ; Surip, S.N. ; Razak, S.B.A.

  • Author_Institution
    Dept. of Manuf. & Mater. Eng., Int. Islamic Univ. Malaysia, Kuala Lumpur, Malaysia
  • fYear
    2012
  • fDate
    23-26 Sept. 2012
  • Firstpage
    473
  • Lastpage
    476
  • Abstract
    This paper investigates the impact strength of plasticized polylactic acid (PLA) filled with kenaf fiber (KF) and montmorrilonite (MMT). The compositional ratio of PLA, KF and MMT is 77:20:3. Hybrid biocomposite was prepared through extrusion process and then injection moulded. PLA is one of the biodegradable polymers that have poor impact properties. Therefore, to overcome this problem, 3 wt% polyethylene glycol (PEG) was added as a plasticizer in the processing of hybrid biocomposite. From the Charpy impact test, impact strength of plasticized biocomposite improved significantly as compared to unplasticized biocomposite. The impact strength of various composition of biocomposite increased with the presence of PEG, and p-PLA-KF-MMT posses the highest impact strength which is 89.5 kJ/m2. Transmission electron micrograph (TEM) of hybrid biocomposite revealed the well-distributed of MMT with intercalated structure.
  • Keywords
    composite materials; fibres; impact (mechanical); impact strength; impact testing; injection moulding; plasticity; transmission electron microscopy; Charpy impact test; PEG effect; PLA hybrid biocomposite; TEM; compositional ratio; impact properties; impact strength; kenaf fiber; montmorrilonite; p-PLA-KF-MMT; plasticized biocomposite; plasticized polylactic acid; polyethylene glycol; transmission electron micrograph; Dispersion; Glass; Natural fibers; Plastics; Programmable logic arrays; Temperature; Hybrid Biocomposite; Impact Strength; Plasticizer; Polyethylene Glycol;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Business, Engineering and Industrial Applications (ISBEIA), 2012 IEEE Symposium on
  • Conference_Location
    Bandung
  • Print_ISBN
    978-1-4577-1632-4
  • Type

    conf

  • DOI
    10.1109/ISBEIA.2012.6422930
  • Filename
    6422930