Fabrication of 340-GHz Folded Waveguides Using KMPR Photoresist

Author

Hanyan Li ; Yongtao Li ; Jinjun Feng

Author_Institution

Beijing Vacuum Electron. Res. Inst., Beijing, China

Volume

34

Issue

3

fYear

2013

fDate

Mar-13

Firstpage

462

Lastpage

464

Abstract

This letter presents the fabrication of 340-GHz copper folded waveguides (FWGs) using the UV-LIGA method. During the process, KMPR photoresist was employed instead of SU-8 due to its easy removability after electroforming. KMPR patterns with a sidewall height of 300 μm and a trench width of 100 μm were achieved repeatedly under one single-spin deposition and optimized processing conditions, such as UV exposure dose and KMPR bake temperature and time. The dimensional accuracies of the wide side (500 μm ) and narrow side (100 μm) of the copper FWGs were found to be ≤ 6 and ≤ 2 μm, respectively, and the sidewall surface roughness was about 44 nm, with a profile of about 90°.

Keywords

LIGA; copper; photoresists; submillimetre wave circuits; waveguides; Cu; FWG; KMPR photoresist; SU-8 photoresist; UV-LIGA method; copper folded waveguide fabrication; electroforming; frequency 340 GHz; optimized processing condition; sidewall surface roughness; single-spin deposition; size 100 mum; size 300 mum; Copper; Microscopy; Optical device fabrication; Optical microscopy; Resists; Rough surfaces; KMPR; UV-LIGA; microfabrication; terahertz;

fLanguage

English

Journal_Title

Electron Device Letters, IEEE

Publisher

ieee

ISSN

0741-3106

Type

jour

DOI

10.1109/LED.2013.2241389

Filename

6463427