• DocumentCode
    593984
  • Title

    Process-tolerant Surface Acoustic Wave delay lines

  • Author

    Malik, Aamir F. ; Burhanudin, Z.A. ; Jeoti, Varun ; Jamali, A.J. ; Hashim, U. ; Foo, K.L.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Univ. Teknol. PETRONAS, Tronoh, Malaysia
  • fYear
    2012
  • fDate
    11-13 Dec. 2012
  • Firstpage
    187
  • Lastpage
    190
  • Abstract
    Surface Acoustic Wave (SAW) delay lines microfabrication is outlined and its characteristics due to wet chemical etching process variation are investigated. The SAW delay lines consist of Al inter-digital transducers (IDT) on LiNbO3 substrate. It is designed with specific IDT feature size to produce SAW at predetermined central frequency, f0. The effect of the etching process onto the IDT, in particular the feature size, is investigated using field emission secondary electron microscope (FESEM). The effect is then translated into transfer characteristics of the SAW delay lines by measuring its transmission and reflection coefficient using network analyzer. It is found that even with a ~5 μm IDT feature size variation due to the wet chemical etching process, the fabricated delay lines can still produce SAW at the designed f0, and hence a process-tolerant SAW delay lines.
  • Keywords
    aluminium; etching; lithium compounds; niobium compounds; surface acoustic wave delay lines; Al; FESEM; LiNbO3; field emission secondary electron microscope; interdigital transducer; network analyzer; process-tolerant SAW delay line; reflection coefficient measurement; surface acoustic wave delay line microfabrication; transfer characteristics; transmission measurement; wet chemical etching process variation; Delay lines; Fingers; Frequency measurement; Piezoelectric transducers; Substrates; Surface acoustic waves; Delay Line; IDT; LiNbO3; SAW; Sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Electromagnetics (APACE), 2012 IEEE Asia-Pacific Conference on
  • Conference_Location
    Melaka
  • Print_ISBN
    978-1-4673-3114-2
  • Type

    conf

  • DOI
    10.1109/APACE.2012.6457657
  • Filename
    6457657