• DocumentCode
    597216
  • Title

    Process/design co-optimization of regular logic tiles for double-gate silicon nanowire transistors

  • Author

    Bobba, Shashikanth ; Gaillardon, Pierre-Emmanuel ; Jian Zhang ; De Marchi, Michele ; Sacchetto, Davide ; Leblebici, Yusuf ; De Micheli, G.

  • Author_Institution
    LSI, EPFL, Lausanne, Switzerland
  • fYear
    2012
  • fDate
    4-6 July 2012
  • Firstpage
    55
  • Lastpage
    60
  • Abstract
    Ambipolar transistors with on-line configurability to n-type and p-type polarity are desirable for future integrated circuits. Regular logic tiles have been recognized as an efficient layout fabric for ambipolar devices. In this work, we present a process/design co-optimization approach for designing logic tiles for double-gate silicon nanowire field effect transistors (DG-SiNWFET) technology. A compact Verilog-A model of the device is extracted from TCAD simulations. Cell libraries with different tile configurations are mapped to study the performance of DG-SiNWFET technology at various technology nodes. With an optimal tile size comprising of 6 vertically-stacked nanowires, we observe 1.6x improvement in area, 2x decrease in the leakage power and 1.8x improvement in delay when compared to Si-CMOS.
  • Keywords
    elemental semiconductors; field effect transistors; logic design; logic gates; nanoelectronics; nanowires; optimisation; process design; silicon; technology CAD (electronics); DG-SiNWFET technology; Si-CMOS; TCAD simulations; Verilog-A model; ambipolar transistors; cell libraries; double gate silicon nanowire field effect transistors; layout fabric; n-type polarity; p-type polarity; process-design cooptimization; regular logic tiles; tile configurations; CMOS integrated circuits; Delay; Integrated circuit modeling; Layout; Logic gates; Tiles; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoscale Architectures (NANOARCH), 2012 IEEE/ACM International Symposium on
  • Conference_Location
    Amsterdam
  • Print_ISBN
    978-1-4503-1671-2
  • Type

    conf

  • Filename
    6464144