An influence factor of high reliable thermosonic au wire-bonding

Author

Bin Wang ; Xiu-ying Mo ; Hong-Wei Li

Author_Institution

Sci. & Technol. on Electron. Test & Meas. Lab., Qingdao, China

fYear

2012

fDate

Oct. 29 2012-Nov. 1 2012

Firstpage

1

Lastpage

3

Abstract

Thermosonic bonding has been found to be a promising process in microelectronic packaging industry. It provides electrical interconnects between semi-conductor, hybrid, or microwave devices. Gold wire wedge bonding has been widely used in microwave communications and surveillance projects for its nicer high frequency characteristics. In this thesis, the roughness of the bonding tools tip as one of the factors which influence the bonding quality was presented. The mechanism and the results of experimentation were introduced in detail.

Keywords

gold; integrated circuit interconnections; tape automated bonding; bonding quality; bonding tools tip; electrical interconnects; frequency characteristics; gold wire wedge bonding; hybrid device; influence factor; microelectronic packaging industry; microwave communications; microwave device; semiconductor device; surveillance projects; thermosonic gold wire-bonding; Acoustics; Bonding; Force; Gold; Rough surfaces; Surface roughness; Wires; bonding quality; influence factor; roughness; wire bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4673-2474-8

Type

conf

DOI

10.1109/ICSICT.2012.6467732

Filename

6467732