DocumentCode
598738
Title
(Invited) Challenges in Engineering RRAM technology for high density applications
Author
Ramaswamy, Nirmal
Author_Institution
Emerging Memory Group, Micron Technology
fYear
2012
fDate
14-18 Oct. 2012
Firstpage
1
Lastpage
1
Abstract
Summary form only given. Although RRAM technology shows significant potential to be a major component of future memory systems, significant challenges exist for high density RRAM applications. Some of these critical challenges such as read noise, retention, endurance and tail bit performance will be discussed.
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
Conference_Location
South Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4673-2749-7
Type
conf
DOI
10.1109/IIRW.2012.6468902
Filename
6468902
Link To Document