DocumentCode
598739
Title
Resistive switching random access memory — Materials, device, interconnects, and scaling considerations
Author
Yi Wu ; Jiale Liang ; Shimeng Yu ; Ximeng Guan ; Wong, H.-S Philip
Author_Institution
Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
fYear
2012
fDate
14-18 Oct. 2012
Firstpage
16
Lastpage
21
Abstract
In this paper, we review recent progresses on metal oxide resistive switching memory (RRAM). RRAM device design is explored from different aspects including oxide/electrode materials, uniformity issues, and scaling down to single-digit-nm regime. We studied the stochastic nature of resistive switching in metal oxide RRAM and revealed the physics behind switching parameter variations in HfOx-based RRAM using a 2D analytical solver. In a forward-looking analysis into the sub-10 nm regime, we investigated the impact of wordline/bitline metal wire scaling on the read/write performance, energy consumption in the cross-point memory array architecture.
Keywords
electrodes; integrated circuit design; integrated circuit interconnections; memory architecture; random-access storage; switching circuits; 2D analytical solver; HfO; RRAM device design; cross-point memory array architecture; energy consumption; forward-looking analysis; metal oxide RRAM; metal oxide resistive switching memory; oxide-electrode materials; resistive switching random access memory; switching parameter variations; wordline-bitline metal wire scaling; Arrays; Electrodes; Materials; Metals; Resistance; Switches; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
Conference_Location
South Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4673-2749-7
Type
conf
DOI
10.1109/IIRW.2012.6468906
Filename
6468906
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