• DocumentCode
    598739
  • Title

    Resistive switching random access memory — Materials, device, interconnects, and scaling considerations

  • Author

    Yi Wu ; Jiale Liang ; Shimeng Yu ; Ximeng Guan ; Wong, H.-S Philip

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
  • fYear
    2012
  • fDate
    14-18 Oct. 2012
  • Firstpage
    16
  • Lastpage
    21
  • Abstract
    In this paper, we review recent progresses on metal oxide resistive switching memory (RRAM). RRAM device design is explored from different aspects including oxide/electrode materials, uniformity issues, and scaling down to single-digit-nm regime. We studied the stochastic nature of resistive switching in metal oxide RRAM and revealed the physics behind switching parameter variations in HfOx-based RRAM using a 2D analytical solver. In a forward-looking analysis into the sub-10 nm regime, we investigated the impact of wordline/bitline metal wire scaling on the read/write performance, energy consumption in the cross-point memory array architecture.
  • Keywords
    electrodes; integrated circuit design; integrated circuit interconnections; memory architecture; random-access storage; switching circuits; 2D analytical solver; HfO; RRAM device design; cross-point memory array architecture; energy consumption; forward-looking analysis; metal oxide RRAM; metal oxide resistive switching memory; oxide-electrode materials; resistive switching random access memory; switching parameter variations; wordline-bitline metal wire scaling; Arrays; Electrodes; Materials; Metals; Resistance; Switches; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
  • Conference_Location
    South Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4673-2749-7
  • Type

    conf

  • DOI
    10.1109/IIRW.2012.6468906
  • Filename
    6468906