Electromagnetic Band Gap structure for cut off of low frequency noise in 3-D printed circuit board

Author

Sasaki, T. ; Yamada, Hiroyoshi ; Itaya, Kazuhiko ; Kijima, Takashi ; Imura, K.

Author_Institution

Corp. R&D Center, Toshiba Corp., Kawasaki, Japan

fYear

2012

fDate

10-12 Dec. 2012

Firstpage

1

Lastpage

4

Abstract

This paper describes the design of mushroom EBG (Electromagnetic Band Gap) structure within slit defected on power supply plane in order to control PI (power integrity) for realizing high-density multi-stacked printed circuit board. Generally, EBG structure is not suitable to block the low frequency noise around 1GHz in the printed circuit board, because EBG structure requires large area to cutoff low frequency noise. In this paper, new type of mushroom EBG structure, which has slit defect on power supply plane, to increase inductance for EBG function was proposed. By applying the new mushroom EBG structure of small patch size 10mm × 10mm × 3 pieces in the 0.9 mm thickness printed circuit board, we realized -40dB isolation at stop band frequency 0.94GHz~1.25GHz. Consequentially, the multi-stacked printed circuit board thickness could be reduced to 81% of using conventional mushroom EBG structure.

Keywords

circuit noise; photonic band gap; printed circuit design; 3D printed circuit board; electromagnetic band gap structure; frequency 0.94 GHz to 1.25 GHz; high-density multistacked printed circuit board; low frequency noise; mushroom EBG structure; power supply plane; size 0.9 mm; size 10 mm; slit defect;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan, 2012 2nd IEEE

Conference_Location

Kyoto

Print_ISBN

978-1-4673-2654-4

Type

conf

DOI

10.1109/ICSJ.2012.6523447

Filename

6523447