DocumentCode
602836
Title
Novel fabrication technique for Ge membranes
Author
Shah, V.A. ; Myronov, M. ; Bawden, L. ; Prest, M.J. ; Richardson-Bullock, J.S. ; Gammon, P.M. ; Rhead, S. ; Parker, E.H.C. ; Whall, T.E. ; Leadley, D.R.
Author_Institution
Phys. Dept., Warwick Univ., Coventry, UK
fYear
2013
fDate
19-21 March 2013
Firstpage
181
Lastpage
184
Abstract
Suspended crystalline Ge semiconductor structures are created on a Si(001) substrate by a combination of epitaxial growth and simple patterning from the front surface using anisotropic underetching. Geometric definition of the surface Ge layer gives access to a range of crystalline planes that have different etch resistance. The structures are aligned to avoid etch-resistive planes in making the suspended regions and to take advantage of these planes to retain the underlying Si to support the structures. The technique is demonstrated by forming suspended microwires, spiderwebs and van der Pauw cross structures. We finally report on the low-temperature electrical isolation of the undoped Ge layers. This novel isolation method increases the Ge resistivity to 280 Ω cm at 10 K, over two orders of magnitude above that of a bulk Ge on Si(001) layer, by removing material containing the underlying misfit dislocation network that otherwise provides the main source of electrical conduction.
Keywords
chemical vapour deposition; dislocations; electrical conductivity; electrical resistivity; elemental semiconductors; etching; germanium; membranes; semiconductor epitaxial layers; semiconductor growth; vapour phase epitaxial growth; Ge; Si; Si(OOl) substrate; anisotropic underetching; electrical conduction; epitaxial growth; low-temperature electrical isolation; membranes; misfit dislocation network; patterning; reduced-pressure chemical vapour deposition; resistivity; spiderwebs; suspended crystalline germanium semiconductor structures; suspended microwires; temperature 10 K; van der Pauw cross structures; Epitaxial growth; Germanium; Heating; Lead; Silicon; Silicon germanium; Thickness measurement; Ge; RP-CVD; TMAH; anisotropic; conduction; dislocation; etch; germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultimate Integration on Silicon (ULIS), 2013 14th International Conference on
Conference_Location
Coventry
Print_ISBN
978-1-4673-4800-3
Electronic_ISBN
978-1-4673-4801-0
Type
conf
DOI
10.1109/ULIS.2013.6523514
Filename
6523514
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