• DocumentCode
    612510
  • Title

    Toward Transparent Virtual Coupling for Haptic Interaction during Contact Tasks

  • Author

    Myungsin Kim ; Dongjun Lee

  • Author_Institution
    Sch. of Mech. & Aerosp. Eng., Seoul Nat. Univ., Seoul, South Korea
  • fYear
    2013
  • fDate
    14-17 April 2013
  • Firstpage
    163
  • Lastpage
    168
  • Abstract
    Since its introduction (e.g., [4, 6]), virtual coupling technique has been de facto way to connect a haptic device with a virtual proxy for haptic rendering and control. However, because of the single dependence on spring-damper feedback action, this virtual coupling suffers from the degraded transparency particularly during contact tasks when large device/proxy-forces are involved. In this paper, we propose a novel virtual coupling technique, which, by utilizing passive decomposition, reduces device-proxy position deviation even during the contact tasks while also scaling down (or up) the apparent inertia of the coordinated device-proxy. By doing so, we can significantly improve transparency between multiple degree-of-freedom (possibly nonlinear) haptic device and virtual proxy. In other to use passive decomposition, disturbance observer of [3] is adopted to estimate human force with some dead-zone modification to avoid “winding-up” force estimation in the presence of device-torque saturation. Some preliminary experimental results are also given to illustrate efficacy of the proposed technique.
  • Keywords
    feedback; haptic interfaces; rendering (computer graphics); task analysis; virtual reality; contact tasks; haptic control; haptic device; haptic interaction; haptic rendering; multiple degree-of-freedom; spring-damper feedback; transparent virtual coupling; virtual proxy; Couplings; Force; Haptic interfaces; High definition video; Observers; Shape; Torque; contact task; disturbance observer; multi-link virtual proxy; passive decomposition; passivity; transparency; virtual coupling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    World Haptics Conference (WHC), 2013
  • Conference_Location
    Daejeon
  • Print_ISBN
    978-1-4799-0087-9
  • Type

    conf

  • DOI
    10.1109/WHC.2013.6548402
  • Filename
    6548402