• DocumentCode
    614448
  • Title

    Functional film peculiarities of the «metal-insulator-metal» structure devices

  • Author

    Korobova, N. ; Vodopyanov, V. ; Stepanova, Yu. ; Cherkasova, Yu. ; Timoshenkov, S. ; Plis, N. ; Isaikina, O.

  • Author_Institution
    Dept. of Microelectron., Nat. Res. Univ. of Electron. Technol., Zelenograd, Russia
  • fYear
    2013
  • fDate
    16-19 April 2013
  • Firstpage
    112
  • Lastpage
    114
  • Abstract
    The important parts of material science in the film preparation fields and sol-gel technology are presented. Al2O3/SiO2 and ZrO2/Y2O3 films have been prepared by electrophoresis deposition of organometallic compounds as dielectric coatings on metal substrates and annealed at different temperatures. The films were characterized by X-ray diffraction (XRD), atomic force and scanning microscopy (AFM) and (SEM) respectively. The surface grains appeared to get larger in size and the root mean square roughness of the annealed films increased with the annealing temperature but was less than that of the as-deposited. The properties dependence of the film´s chemical composition, impurities and microstructure, which are closely correlated with the deposition technique and conditions were investigated. A short analysis of sol-gel technology and thin film preparation methods of dielectric materials has been given.
  • Keywords
    MIM devices; X-ray diffraction; aluminium compounds; annealing; atomic force microscopy; chemical analysis; coating techniques; dielectric thin films; electrophoresis; mean square error methods; organometallic compounds; scanning electron microscopy; semiconductor thin films; silicon compounds; sol-gel processing; yttrium compounds; zirconium compounds; AFM; Al2O3-SiO2; SEM; X-ray diffraction; XRD; ZrO2-Y2O3; annealing temperature; atomic force microscopy; dielectric coating; dielectric material; electrophoresis deposition; film annealing; film chemical composition; film preparation field; functional film peculiarity; impurities; material science; metal substrate; metal-insulator-metal structure device; microstructure; organometallic compound; root mean square roughness; scanning electron microscopy; sol-gel technology; surface grain; thin film preparation; Aluminum oxide; Annealing; Coatings; Films; Substrates; functional dielectrics; microstructure; thin films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and Nanotechnology (ELNANO), 2013 IEEE XXXIII International Scientific Conference
  • Conference_Location
    Kiev
  • Print_ISBN
    978-1-4673-4669-6
  • Type

    conf

  • DOI
    10.1109/ELNANO.2013.6552026
  • Filename
    6552026