• DocumentCode
    615630
  • Title

    Characterization of UHMWPE/POSS composite prepared by ball milling

  • Author

    Guo, Minyi ; Frechette, M.F. ; David, E. ; Couderc, H. ; Savoie, S. ; Bouanga, C. Vanga ; Demarquette, Nicole R.

  • Author_Institution
    Ecole de Technol. Super. (ETS), Montréal, QC, Canada
  • fYear
    2013
  • fDate
    2-5 June 2013
  • Firstpage
    444
  • Lastpage
    448
  • Abstract
    The incorporation of polyhedral oligomeric silsesquioxane (POSS) into polymeric materials may result in great improvements of polymer properties including electrical dielectric properties. However, the success of achieving such a material with improved properties relies on a proper dispersion and distribution of POSS within the polymer. In this paper, ball milling is used to prepare UHMWPE/POSS 95/5 wt% composites and proven to be an easy and effective method to disperse POSS within UHMWPE at a submicron to micron scale with acceptable distribution. Moreover, the morphological, thermal and electrical characteristics of the resulting composites are characterized by scanning electron microscopy (SEM), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), broadband dielectric spectroscopy (BDS) and short-time breakdown.
  • Keywords
    ball milling; composite materials; dielectric properties; differential scanning calorimetry; polymers; scanning electron microscopy; BDS; DSC; SEM; TGA; UHMWPE/POSS composite; ball milling; broadband dielectric spectroscopy; differential scanning calorimetry; electrical dielectric properties; morphological properties; polyhedral oligomeric silsesquioxane; polymeric materials; scanning electron microscopy; short time breakdown; thermal properties; thermogravimetric analysis; Ball milling; Dielectrics; Electric breakdown; Heating; Polymers; Scanning electron microscopy; Octalsobutyl POSS; ball milling; dielectric properties; morphology; nanocomposite; polyethylene; thermal properties;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2013 IEEE
  • Conference_Location
    Ottawa, ON
  • Print_ISBN
    978-1-4673-4738-9
  • Electronic_ISBN
    978-1-4673-4739-6
  • Type

    conf

  • DOI
    10.1109/EIC.2013.6554285
  • Filename
    6554285