DocumentCode
615630
Title
Characterization of UHMWPE/POSS composite prepared by ball milling
Author
Guo, Minyi ; Frechette, M.F. ; David, E. ; Couderc, H. ; Savoie, S. ; Bouanga, C. Vanga ; Demarquette, Nicole R.
Author_Institution
Ecole de Technol. Super. (ETS), Montréal, QC, Canada
fYear
2013
fDate
2-5 June 2013
Firstpage
444
Lastpage
448
Abstract
The incorporation of polyhedral oligomeric silsesquioxane (POSS) into polymeric materials may result in great improvements of polymer properties including electrical dielectric properties. However, the success of achieving such a material with improved properties relies on a proper dispersion and distribution of POSS within the polymer. In this paper, ball milling is used to prepare UHMWPE/POSS 95/5 wt% composites and proven to be an easy and effective method to disperse POSS within UHMWPE at a submicron to micron scale with acceptable distribution. Moreover, the morphological, thermal and electrical characteristics of the resulting composites are characterized by scanning electron microscopy (SEM), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), broadband dielectric spectroscopy (BDS) and short-time breakdown.
Keywords
ball milling; composite materials; dielectric properties; differential scanning calorimetry; polymers; scanning electron microscopy; BDS; DSC; SEM; TGA; UHMWPE/POSS composite; ball milling; broadband dielectric spectroscopy; differential scanning calorimetry; electrical dielectric properties; morphological properties; polyhedral oligomeric silsesquioxane; polymeric materials; scanning electron microscopy; short time breakdown; thermal properties; thermogravimetric analysis; Ball milling; Dielectrics; Electric breakdown; Heating; Polymers; Scanning electron microscopy; Octalsobutyl POSS; ball milling; dielectric properties; morphology; nanocomposite; polyethylene; thermal properties;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference (EIC), 2013 IEEE
Conference_Location
Ottawa, ON
Print_ISBN
978-1-4673-4738-9
Electronic_ISBN
978-1-4673-4739-6
Type
conf
DOI
10.1109/EIC.2013.6554285
Filename
6554285
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