DocumentCode
618604
Title
Comparative analysis of zinc oxide and aluminium doped ZnO for GHz CMOS MEMS surface acoustic wave resonator
Author
Ralib, Aliza Aini Md ; Nordin, A.N.
Author_Institution
Dept. of Electr. & Comput. Eng., Int. Islamic Univ. Malaysia, Kuala Lumpur, Malaysia
fYear
2013
fDate
16-18 April 2013
Firstpage
1
Lastpage
6
Abstract
CMOS integration in RF MEMS have become dominant due to the growing demand of mobile and wireless communication system. Usage of off chip resonators is not efficient since it leads to large area and high interfacing loss. Integration of CMOS with SAW resonators is a possible solution to reduce the loss. In this work, a SAW resonator was developed using AZO/Al/Si layers in 0.18 μm CMOS technology. AZO was chosen as the piezoelectric layer to achieve high electromechanical coupling coefficient for good SAW performance. This paper highlights the comparative analysis of two different piezoelectric materials: pure Zinc Oxide (ZnO) and Aluminium doped Zinc Oxide (AZO) for GHz CMOS MEMS SAW resonator. S parameter measurements were performed for the fabricated designs to get the resonance frequencies and the electromechanical coupling coefficients were recalculated. The design and finite element modeling simulation was conducted using COMSOLTM to verify the performance of the resonator using both Al-doped ZnO and pure ZnO via the simulation results.
Keywords
CMOS analogue integrated circuits; S-parameters; finite element analysis; integrated circuit design; microfabrication; micromechanical resonators; piezoelectric materials; surface acoustic wave resonators; zinc compounds; CMOS integration; CMOS technology; COMSOLTM; GHz CMOS MEMS SAW resonator; GHz CMOS MEMS surface acoustic wave resonator; RF MEMS; S parameter measurement; aluminium-doped zinc oxide; electromechanical coupling coefficient; fabricated design; finite element modeling simulation; loss reduction; mobile communication system; off-chip resonators; piezoelectric layer; piezoelectric material; pure zinc oxide; resonance frequency; size 0.18 mum; wireless communication system; CMOS integrated circuits; Couplings; Insertion loss; Resonant frequency; Surface acoustic waves; Zinc oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
Conference_Location
Barcelona
Print_ISBN
978-1-4673-4477-7
Type
conf
Filename
6559389
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