Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding

Author

Yamamoto, Ryo ; Sueyoshi, K. ; Otsuka, Kanji

Author_Institution

Major in Nano-Sci. & Nano-Eng., Waseda Univ., Tokyo, Japan

fYear

2013

fDate

7-10 April 2013

Firstpage

418

Lastpage

421

Abstract

Au deposited SU-8 microdots comprised SU-8-PET microchip using low temperature polymer bonding technology is developed. A fine microdot array (1μm×1μm×0.5μm dots with 2μm pitch in area of 50μm×5mm) is fabricated by electron beam lithography (EBL) using SU-8 as a negative tone resist. A microchannel structure is formed with UV patterned SU-8 on a glass substrate. The SU-8 structure is sealed with a PET film by low temperature silane coupling bonding (140^oC, 1.5MPa, 5min). The proposed microchip is fabricated successfully without leakage and is applicable as a microchip electrophoresis.

Keywords

bioMEMS; bonding processes; electron beam lithography; electrophoresis; gold; lab-on-a-chip; low-temperature techniques; microfabrication; photoresists; polymer films; Au; EBL; PET film; UV patterned SU-8 structure; electron beam lithography; functional SU-8-PET composite microchip fabrication; glass substrate; low temperature polymer bonding technology; low temperature silane coupling bonding; microchannel structure; microchip electrophoresis; microdot array; negative tone resist; temperature 140 degC; time 5 min; Arrays; Bonding; Electron beams; Gold; Microchannel; Polymers; Positron emission tomography; Au microdot array; SU-8 electron beam lithography; dielectrophoresis; low temperature silane coupling bonding; microchip electrophoresis;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on

Conference_Location

Suzhou

Electronic_ISBN

978-1-4673-6351-8

Type

conf

DOI

10.1109/NEMS.2013.6559762

Filename

6559762