High impact-induced failure of a novel solid MEMS switch

Author

Wang Ying ; Lou Wenzhong ; Zhao Yue ; Wang Fufu

Author_Institution

State Key Lab. of Mechatron. Eng. & Control, Beijing Inst. of Technol., Beijing, China

fYear

2013

fDate

7-10 April 2013

Firstpage

755

Lastpage

758

Abstract

Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.

Keywords

failure analysis; microswitches; reliability; FEM simulation analysis; MEMS initiator market; MEMS initiator reliability; MEMS initiator security; high-impact-induced failure; potential failure modes; solid MEMS switch; Analytical models; Finite element analysis; Micromechanical devices; Microswitches; Solids; Strain; Stress; high impact; leads; reliability; simulation; the novel solid MEMS switch;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on

Conference_Location

Suzhou

Electronic_ISBN

978-1-4673-6351-8

Type

conf

DOI

10.1109/NEMS.2013.6559838

Filename

6559838