DocumentCode
621107
Title
Effect of aging on power integrity of digital integrated circuits
Author
Boyer, A. ; Ben Dhia, S.
Author_Institution
LAAS, Univ. de Toulouse, Toulouse, France
fYear
2013
fDate
3-5 April 2013
Firstpage
1
Lastpage
5
Abstract
Recent studies have shown that integrated circuit aging modifies electromagnetic emission significantly. The proposed paper aims at evaluating the impact of aging on the power integrity of digital integrated circuits and clarifying its origin. On-chip measurements of power supply voltage bounces in a CMOS 90 nm technology test chip are combined with electric stress to characterize the influence of aging on power integrity. Simulation based on ICEM modeling modified by an empirical coefficient in order to take into account the circuit aging is proposed to model the evolution of the power integrity induced by device aging.
Keywords
CMOS digital integrated circuits; ageing; integrated circuit measurement; integrated circuit modelling; integrated circuit testing; power integrated circuits; CMOS technology; ICEM modeling; device aging; digital integrated circuit aging; electric stress; electromagnetic emission; empirical coefficient; on-chip measurement; power integrity; power supply voltage; size 90 nm; test chip; Aging; CMOS integrated circuits; CMOS technology; Clocks; Geometry; MOS devices; Switches; ICEM modelling; Integrated circuits; accelerated aging; power integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Workshop (LATW), 2013 14th Latin American
Conference_Location
Cordoba
Print_ISBN
978-1-4799-0595-9
Type
conf
DOI
10.1109/LATW.2013.6562681
Filename
6562681
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