Considerations for the use of low-cost substrates for MM-wave packaging

Author

Aroor, S. ; Henderson, Robert

Author_Institution

Univ. of Texas at Dallas, Richardson, TX, USA

fYear

2013

fDate

4-5 April 2013

Firstpage

1

Lastpage

4

Abstract

CMOS technology has enabled the design and fabrication of millimeter-wave integrated circuits at a reasonably low cost. If integrated with a low-cost packaging substrate, high volume fabrication can lead to affordable consumer products. Coplanar waveguide attenuation has been studied on substrates with varying dielectric and metal properties. Challenges, advantages and design considerations are presented that result from using FR-4 substrates to improve the cost of millimeter-wave packages.

Keywords

MMIC; consumer products; coplanar waveguides; packaging; waveguide attenuators; CMOS technology; FR-4 substrates; MM-wave packaging; consumer products; coplanar waveguide attenuation; design considerations; dielectric property; low-cost packaging substrate; low-cost substrates; metal property; millimeter-wave integrated circuits; millimeter-wave packages; volume fabrication; Attenuation; Coplanar waveguides; Metals; Packaging; Substrates; Transmission line measurements; FR-4; attenuation; coplanar waveguide; packaging; substrates; surface finish;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless and Microwave Circuits and Systems (WMCS), 2013 Texas Symposium on

Conference_Location

Waco, TX

Print_ISBN

978-1-4799-0456-3

Type

conf

DOI

10.1109/WMCaS.2013.6563558

Filename

6563558