DocumentCode
622640
Title
Performance and power consumption analysis of memory efficient 3D network-on-chip architecture
Author
Xiao Yu ; Li Li ; Yuang Zhang ; Hongbing Pan ; Shuzhuan He
Author_Institution
Dept. of Electron. Sci. & Eng., Nanjing Univ., Nanjing, China
fYear
2013
fDate
12-14 June 2013
Firstpage
340
Lastpage
344
Abstract
With the rapid development of the technology of 3D IC and Network-on-Chip (NoC) technology, 3D NoC emerged and drew more and more attention of researchers in recent years. But the issues of memory organization and power consumption have become two great challenges in the design of 3D NoC. This paper proposed three kinds of memory efficient 3D NoC architecture called core, corner and windows in order to achieve better performance and lower power consumption for the system. A simulation platform of 3D NoC is built with a systematical modeling language -SystemC to evaluate the performance. The experiment result shows that when compared with other two traditional 3D NoC memory architecture perlayer and mixed, two 3D NoC architectures we proposed can gain better performance and lower power consumption respectively.
Keywords
C language; electronic engineering computing; logic design; network-on-chip; 3D IC; 3D NoC architecture; SystemC; memory efficient 3D network-on-chip architecture; power consumption analysis; systematical modeling language; Delays; Memory architecture; Memory management; Organizations; Power demand; Program processors; Routing; 3D NoC; Memory Architecture; Memory Efficient; Power Consumption; SystemC;
fLanguage
English
Publisher
ieee
Conference_Titel
Control and Automation (ICCA), 2013 10th IEEE International Conference on
Conference_Location
Hangzhou
ISSN
1948-3449
Print_ISBN
978-1-4673-4707-5
Type
conf
DOI
10.1109/ICCA.2013.6565107
Filename
6565107
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