Smart System Design: Industrial Challenges and Perspectives

Smart systems consist of heterogeneous subsystems and components providing different functionalities; they are normally implemented as Multi-Package on a Board. To fully exploit the potential of current nano-technologies, as well as to enable the integration of existing/new IPs and More than Moore devices, smart system miniaturization and MultiChip in a Package implementation are unavoidable. Furthermore, such goals are only achievable if dedicated M2M interfaces and SW tools for smart subsystems/components design and integration are available to designers and system integrators. This paper offers an overview of the major challenges, as perceived from the industrial point of view, to be faced when pursuing effective smart system design capabilities, discussing and motivating the needs and the market opportunities.