• DocumentCode
    627747
  • Title

    Emerging hybrid logic circuits based on non-volatile magnetic memories

  • Author

    Weisheng Zhao ; Prenat, G. ; Klein, Jacques-Olivier ; Dieny, Bernard ; Chappert, Claude ; Ravelosona, Dafine

  • Author_Institution
    IEF, Univ. Paris-Sud, Orsay, France
  • fYear
    2013
  • fDate
    16-19 June 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    As the technology node shrinks down to 90 nm and below, high power becomes one of the major critical issues for CMOS high-speed computing circuits (e.g. logic and cache memory) due to the increasing leakage currents and data traffic. Emerging non-volatile memories are under intense investigation to bring the non-volatility into the logic circuits and then eliminate completely the standby power issue. Thanks to its quasi-infinite endurance, high speed and easy 3D integration at the back-end process of CMOS IC fabrication, Magnetic RAM (MRAM) is considered as one of the most promising candidates. A number of hybrid MRAM/CMOS logic circuits have been proposed and prototyped successfully in the last years. In this introduction paper for the invited special session at NEWCAS 2013, we present an overview and current status of these logic circuits and discuss their potential applications in the future.
  • Keywords
    CMOS logic circuits; CMOS memory circuits; MRAM devices; cache storage; 3D integration; CMOS IC fabrication; CMOS high-speed computing circuits; NEWCAS 2013; back-end process; cache memory; data traffic; hybrid MRAM-CMOS logic circuits; leakage currents; magnetic RAM; nonvolatile magnetic memories; quasiinfinite endurance; CMOS integrated circuits; Logic circuits; Magnetic circuits; Magnetic domain walls; Magnetic domains; Magnetic tunneling; Nonvolatile memory; 3D integration; Flip-Flop; Hybrid logic; MRAM; Memory-in-logic; Non-Volatile; Non-volatile; distributed memory cell;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    New Circuits and Systems Conference (NEWCAS), 2013 IEEE 11th International
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4799-0618-5
  • Type

    conf

  • DOI
    10.1109/NEWCAS.2013.6573580
  • Filename
    6573580