Package demonstration of an interposer with integrated TSVs and flexible compliant interconnects

We report on the development of a test package that utilizes a passive silicon interposer with high density and high aspect ratio TSV´s, each integrated with compliant flexible interconnect on one side of the interposer. As opposed to conventional approaches, where TSV interposers are populated with C4 and/or fine pitch micro bumps with multiple interfaces to reflow and permanently attach, our TSV interposers are integrated with micro-spring interconnects on a single side or, potentially, on both sides to provide a truly reworkable or reusable (“rematable”) MCM platform. This makes it possible to test die in package while retaining the ability to replace any that are found flawed. This is a key requirement for increasing assembly yield of advanced MCM packages.