• DocumentCode
    628512
  • Title

    Development of biocompatible coatings on flexible electronics

  • Author

    Das, Rabindra N. ; Egitto, Frank D. ; Poliks, Mark

  • Author_Institution
    Endicott Interconnect Technol., Inc., Endicott, NY, USA
  • fYear
    2013
  • fDate
    28-31 May 2013
  • Firstpage
    1060
  • Lastpage
    1065
  • Abstract
    This paper discusses silicone-coated flexible substrates to provide biocompatibility for implantable devices. In particular, we highlight recent developments on silicone coatings on high density, miniaturized polyimide-based flexible electronics. A variety of high density circuits ranging from 11 microns lines/space to 25 microns lines/spaces were processed on polyimide flex substrates and subsequently coated with biocompatible silicone coatings. The electrical performance of silicone coated batteries was characterized by voltage measurements. The final structure enhances the stretching capability. Biocompatible coatings were characterized by optical microscope to ascertain coating thickness and surface characteristics. An Impedance Analyzer was used for electrical characterization. Silicone coated batteryies are stable after water, acid and base treatments. Voltage change was insignificant even after dipping 75% of the coated battery (i.e., excluding the exposed terminals) in strong KOH (pH:13) solutions for over 60 days. The paper also describes a novel approach for the fabrication of silicone coated, flexible wearable miniaturized electronics for possible clothing applications.
  • Keywords
    biomedical electronics; flexible electronics; polymer films; protective coatings; secondary cells; silicones; voltage measurement; biocompatible coatings; flexible wearable miniaturized electronics; high density circuits; impedance analyzer; implantable devices; optical microscope; polyimide flex substrates; polyimide-based flexible electronics; silicone coated batteries; silicone-coated flexible substrates; voltage measurements; Batteries; Coatings; Flexible electronics; Flexible printed circuits; Polyimides; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4799-0233-0
  • Type

    conf

  • DOI
    10.1109/ECTC.2013.6575704
  • Filename
    6575704