DocumentCode
628512
Title
Development of biocompatible coatings on flexible electronics
Author
Das, Rabindra N. ; Egitto, Frank D. ; Poliks, Mark
Author_Institution
Endicott Interconnect Technol., Inc., Endicott, NY, USA
fYear
2013
fDate
28-31 May 2013
Firstpage
1060
Lastpage
1065
Abstract
This paper discusses silicone-coated flexible substrates to provide biocompatibility for implantable devices. In particular, we highlight recent developments on silicone coatings on high density, miniaturized polyimide-based flexible electronics. A variety of high density circuits ranging from 11 microns lines/space to 25 microns lines/spaces were processed on polyimide flex substrates and subsequently coated with biocompatible silicone coatings. The electrical performance of silicone coated batteries was characterized by voltage measurements. The final structure enhances the stretching capability. Biocompatible coatings were characterized by optical microscope to ascertain coating thickness and surface characteristics. An Impedance Analyzer was used for electrical characterization. Silicone coated batteryies are stable after water, acid and base treatments. Voltage change was insignificant even after dipping 75% of the coated battery (i.e., excluding the exposed terminals) in strong KOH (pH:13) solutions for over 60 days. The paper also describes a novel approach for the fabrication of silicone coated, flexible wearable miniaturized electronics for possible clothing applications.
Keywords
biomedical electronics; flexible electronics; polymer films; protective coatings; secondary cells; silicones; voltage measurement; biocompatible coatings; flexible wearable miniaturized electronics; high density circuits; impedance analyzer; implantable devices; optical microscope; polyimide flex substrates; polyimide-based flexible electronics; silicone coated batteries; silicone-coated flexible substrates; voltage measurements; Batteries; Coatings; Flexible electronics; Flexible printed circuits; Polyimides; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location
Las Vegas, NV
ISSN
0569-5503
Print_ISBN
978-1-4799-0233-0
Type
conf
DOI
10.1109/ECTC.2013.6575704
Filename
6575704
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