DocumentCode
631491
Title
Channel Coupling phenomenon as scaling barrier of NAND flash memory beyond 20nm node
Author
Changhyun Lee ; Jiyeong Hwang ; Fayrushin, Albert ; Hyunjung Kim ; Byoungkeun Son ; Youngwoo Park ; Gyoyoung Jin ; EunSeung Jung
Author_Institution
Semicond. R&D Center, Samsung Electron. Co. Ltd., Hwasung, South Korea
fYear
2013
fDate
26-29 May 2013
Firstpage
72
Lastpage
75
Abstract
A new program disturbance phenomenon appeared from sub 40nm-node NAND flash cell is presented firstly which is named as BTBT Leakage Burst by Channel Coupling (abbr. “Channel Coupling”). With scaling down, the neighboring program channel of 0V grabs strongly the boosted channel at program-inhibited active line not to rise up at the active sidewall and simultaneously, its potential at Si surface is tried to be raised by help of pass voltage. The competition induces the sharp band-bending and thereby sudden enhancement of BTBT leakage, resulting in suppressing channel boosting. In order to overcome “Channel Coupling” appeared at 1X-nm node as a scaling barrier, the air gap in shallow trench isolation is suggested and the effect of the air gap is verified by simulation.
Keywords
NAND circuits; flash memories; BTBT leakage burst; NAND flash memory; Si; channel boosting; channel coupling phenomenon; program disturbance phenomenon; program-inhibited active line; scaling barrier; shallow trench isolation; sharp band-bending; Atmospheric modeling; Couplings; Electric potential; Flash memories; Solid modeling; Temperature measurement; Voltage measurement; BTBT; Channel Boosting; Channel Coupling; NAND flash memory; Program disturbance; Scaling;
fLanguage
English
Publisher
ieee
Conference_Titel
Memory Workshop (IMW), 2013 5th IEEE International
Conference_Location
Monterey, CA
Print_ISBN
978-1-4673-6168-2
Type
conf
DOI
10.1109/IMW.2013.6582101
Filename
6582101
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