• DocumentCode
    631491
  • Title

    Channel Coupling phenomenon as scaling barrier of NAND flash memory beyond 20nm node

  • Author

    Changhyun Lee ; Jiyeong Hwang ; Fayrushin, Albert ; Hyunjung Kim ; Byoungkeun Son ; Youngwoo Park ; Gyoyoung Jin ; EunSeung Jung

  • Author_Institution
    Semicond. R&D Center, Samsung Electron. Co. Ltd., Hwasung, South Korea
  • fYear
    2013
  • fDate
    26-29 May 2013
  • Firstpage
    72
  • Lastpage
    75
  • Abstract
    A new program disturbance phenomenon appeared from sub 40nm-node NAND flash cell is presented firstly which is named as BTBT Leakage Burst by Channel Coupling (abbr. “Channel Coupling”). With scaling down, the neighboring program channel of 0V grabs strongly the boosted channel at program-inhibited active line not to rise up at the active sidewall and simultaneously, its potential at Si surface is tried to be raised by help of pass voltage. The competition induces the sharp band-bending and thereby sudden enhancement of BTBT leakage, resulting in suppressing channel boosting. In order to overcome “Channel Coupling” appeared at 1X-nm node as a scaling barrier, the air gap in shallow trench isolation is suggested and the effect of the air gap is verified by simulation.
  • Keywords
    NAND circuits; flash memories; BTBT leakage burst; NAND flash memory; Si; channel boosting; channel coupling phenomenon; program disturbance phenomenon; program-inhibited active line; scaling barrier; shallow trench isolation; sharp band-bending; Atmospheric modeling; Couplings; Electric potential; Flash memories; Solid modeling; Temperature measurement; Voltage measurement; BTBT; Channel Boosting; Channel Coupling; NAND flash memory; Program disturbance; Scaling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Workshop (IMW), 2013 5th IEEE International
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    978-1-4673-6168-2
  • Type

    conf

  • DOI
    10.1109/IMW.2013.6582101
  • Filename
    6582101