Composition distribution studies of Sn/Ag/Cu solder material using TOF-SIMS, XPS and EDX

Author

Lee, Hwang Soo ; Xing, Z.X. ; Gui, D. ; Hao, Miao ; Shao, J.J. ; Khoo, B.S. ; Shen, Y.Q. ; Li, X.M.

Author_Institution

WinTech Nano-Technol. Services Pte Ltd., Singapore, Singapore

fYear

2013

fDate

15-19 July 2013

Firstpage

158

Lastpage

161

Abstract

Determination of compositional distribution for solder material is of particular interest in the area of failure analysis, specifically in the investigation of various solder alloy formations during the joining processes and interconnection failures. In this paper, we explored several advanced techniques such as time-of-flight secondary ion mass spectrometry (TOF-SIMS), X-ray photoelectron spectroscopy (XPS) and energy-dispersive X-ray spectroscopy (EDX) for characterizing the composition of SnAgCu solder material. Each analysis technique has its advantages in the information attained, thus stimulating multi-technique approaches for material analysis in future.

Keywords

X-ray chemical analysis; copper; failure analysis; interconnections; secondary ion mass spectroscopy; silver; solders; tin; EDX; Sn-Ag-Cu; TOF-SIMS; X-ray photoelectron spectroscopy; XPS; composition distribution; energy-dispersive X-ray spectroscopy; failure analysis; interconnection failures; joining process; material analysis; multitechnique approach; solder alloy formation; solder material; time-of-flight secondary ion mass spectrometry; Backscatter; Integrated circuits; Joints; Lead; Sputtering; Tin; 3-D ion image; EDX; SnAgCu solder material; TOF-SIMS; XPS;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the

Conference_Location

Suzhou

ISSN

1946-1542

Print_ISBN

978-1-4799-1241-4

Type

conf

DOI

10.1109/IPFA.2013.6599145

Filename

6599145