• DocumentCode
    633870
  • Title

    High resolution Magnetic Current Imaging for die level short localization

  • Author

    Gaudestad, J. ; Gagliolo, N. ; Talanov, V.V. ; Yeh, R.H. ; Ma, C.J.

  • Author_Institution
    Neocera, LLC, Beltsville, MD, USA
  • fYear
    2013
  • fDate
    15-19 July 2013
  • Firstpage
    347
  • Lastpage
    350
  • Abstract
    Magnetic Field Imaging (MFI) technology is capable of localize shorts using Magnetic Current Imaging (MCI) technique with a very high spatial resolution [1]. In this paper we demonstrate that a Giant Magneto Resistance (GMR) sensor positioned in close proximity to the front side of a die sample enables MFI to achieve sub micron resolution.
  • Keywords
    failure analysis; fault location; giant magnetoresistance; integrated circuit reliability; integrated circuit testing; magnetic field measurement; magnetic sensors; magnetoresistive devices; die level short localization; giant magnetoresistance sensor; high resolution magnetic current imaging; magnetic field imaging technology; Decision support systems; Failure analysis; Integrated circuits; Radio frequency; SQUIDs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
  • Conference_Location
    Suzhou
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-1241-4
  • Type

    conf

  • DOI
    10.1109/IPFA.2013.6599179
  • Filename
    6599179
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=633870