• DocumentCode
    633873
  • Title

    Electrical properties of N-type CdS and P-type CdTe thin films in CdS/CdTe solar cells

  • Author

    Jingjin Wu ; Ang, Federico ; Cezhou Zhao ; Smith, Jeffrey S.

  • Author_Institution
    Dept. of Electr. Eng. & Electron., Univ. of Liverpool, Liverpool, UK
  • fYear
    2013
  • fDate
    15-19 July 2013
  • Firstpage
    385
  • Lastpage
    389
  • Abstract
    Cadmium Sulfide thin films have been deposited on cleaned glass substrates in vacuum at various deposition conditions. The Cadmium Telluride powder was coated on copper foil by three methods respectively. Then, the samples were sintered at high temperature in a furnace. The effects of the deposition conditions on the thin film properties were investigated by measuring electrical resistivity and conduction type. By investigating the electrical properties of the thin films, we find that the thin film transparency strongly depends on the Cadmium dopant concentration rather than the thickness. On the other hand, the CdTe/Cu sintered film shows a strong p-type property and has an extremely small resistivity. Pinholes and cracks of the thin films were also discussed.
  • Keywords
    II-VI semiconductors; cadmium compounds; cracks; doping profiles; electrical conductivity; electrical resistivity; semiconductor growth; semiconductor thin films; sintering; transparency; vacuum deposition; wide band gap semiconductors; CdS; CdS-CdTe solar cells; CdTe; SiO2; cadmium dopant concentration; cadmium sulfide thin films; cadmium telluride powder; cleaned glass substrates; copper foil; cracks; electrical conduction; electrical properties; electrical resistivity; n-type CdS thin films; p-type CdTe thin films; p-type property; pinholes; sintering; thin film transparency; vacuum deposition; Decision support systems; Failure analysis; Films; Integrated circuits; Photovoltaic cells; Physics; Three-dimensional displays; CdS; CdTe; electrical properties; morphology; thin films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
  • Conference_Location
    Suzhou
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-1241-4
  • Type

    conf

  • DOI
    10.1109/IPFA.2013.6599187
  • Filename
    6599187