• DocumentCode
    633889
  • Title

    Investigation of EOS damage issue induced by failure analysis on back-end test vehicle

  • Author

    Hong Bo Zhang ; Kaeng Nan Liew ; Ren De Lin

  • Author_Institution
    United Microelectron. Corp. (Singapore Branch), Ltd., Singapore, Singapore
  • fYear
    2013
  • fDate
    15-19 July 2013
  • Firstpage
    546
  • Lastpage
    549
  • Abstract
    Back-end Test Vehicle (BTV) test-key responds to BEOL status effectively. In different process node, it can assist in monitoring real product process inline BEOL status by using fewer process steps. FA is very important steps to confirm the failure Device-Under-Test (DVT) for yield improvement in the BTV validation flow. FA has more and more challenges in advanced process nodes, one of them is EOS damage issue, which issue occurred during the BTV test-key failure analysis in advanced process node. The EOS didn´t come out previous process node and above. This paper will investigate which FA steps on earth happened EOS damage, after that, EOS root cause and solved method was discussed base on experiment result.
  • Keywords
    failure analysis; integrated circuit testing; integrated circuit yield; BTV test-key failure analysis; BTV validation flow; EOS damage issue; EOS root cause; FA; back-end test vehicle; failure DVT; failure device-under-test; process node; real product process inline BEOL status; yield improvement; Chemicals; Earth Observing System; Grounding; Layout; Metals; Monitoring; Performance evaluation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
  • Conference_Location
    Suzhou
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-1241-4
  • Type

    conf

  • DOI
    10.1109/IPFA.2013.6599220
  • Filename
    6599220