• DocumentCode
    636569
  • Title

    Temperature distributions measurement of high intensity focused ultrasound using a thin-film thermocouple array and estimation of thermal error caused by viscous heating

  • Author

    Matsuki, Kosuke ; Narumi, Ryuta ; Azuma, Teruaki ; Yoshinaka, Kiyoshi ; Sasaki, A. ; Okita, Kohei ; Takagi, Shinichi ; Matsumoto, Yuki

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Tokyo, Tokyo, Japan
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    3722
  • Lastpage
    3725
  • Abstract
    To improve the throughput of high intensity focused ultrasound (HIFU) treatment, we have considered a focus switching method at two points. For this method, it is necessary to evaluate the thermal distribution under exposure to ultrasound. The thermal distribution was measured using a prototype thin-film thermocouple array, which has the advantage of minimizing the influence of the thermocouple on the acoustic and temperature fields. Focus switching was employed to enlarge the area of temperature increase and evaluate the proposed evaluation parameters with respect to safety and uniformity. The results indicate that focus switching can effectively expand the thermal lesion while maintaining a steep thermal boundary. In addition, the influence caused by the thin-film thermocouple array was estimated experimentally. This thermocouple was demonstrated to be an effective tool for the measurement of temperature distributions induced by HIFU.
  • Keywords
    biothermics; temperature distribution; ultrasonic therapy; focus switching method; high intensity focused ultrasound treatment; steep thermal boundary; temperature distributions measurement; thermal error estimation; thermal lesion; thin-film thermocouple array; viscous heating; Arrays; Heating; Switches; Temperature distribution; Temperature measurement; Ultrasonic imaging; Ultrasonic variables measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6610352
  • Filename
    6610352