DocumentCode
636923
Title
Preparation and evaluation of collagen I/ gellan Gum/β-TCP microspheres as bone graft substitute materials
Author
Kai-Chi Ku ; Ming-Wei Lee ; Shyh Ming Kuo ; Chun-Hsu Yao ; Shwu-Jen Chang
Author_Institution
Dept. of Biomed. Eng., I-Shou Univ., Kaohsiung, Taiwan
fYear
2013
fDate
3-7 July 2013
Firstpage
6667
Lastpage
6670
Abstract
Collagen I is the main component of protein in bone and exhibits many excellent applications in biomedical fields. Gellan gum possesses good biocompatible, biodegradable and good mechanical property, and shows great potentials as tissue engineering scaffold or cell culture substrate. Therefore, the aim of this study was to use collagen I, gellan gum and β-TCP to prepare collagen I/gellan gum/β-TCP microspheres by emulsion method as bone graft substitute materials. The preliminary results showed that collagen I/gellan gum/β-TCP microspheres had particle size distribution between 500-1000 μP in diameter and exhibited better mechanical strength. These microspheres also showed good biocompatibility in cell activity test.
Keywords
bioceramics; biochemistry; bone; calcium compounds; cellular biophysics; emulsions; materials preparation; mechanical strength; molecular biophysics; proteins; tissue engineering; Ca3(PO4)2; beta-TCP microsphere; biocompatible material; biodegradable materail; biomedical field application; bone graft substitute material; cell activity test; cell culture substrate; collagen I microsphere; emulsion method; gellan gum microsphere; material preparation; mechanical property; mechanical strength; particle size distributio; protein component; tissue engineering scaffold; tricalcium phosphate; Bone tissue; Bones; Ceramics; Educational institutions; Tissue engineering; Animals; Bone Substitutes; Calcium Phosphates; Cells, Cultured; Collagen Type I; Materials Testing; Microspheres; Osteoblasts; Polysaccharides, Bacterial; Rats; Rats, Sprague-Dawley;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6611085
Filename
6611085
Link To Document