DocumentCode
637983
Title
Table of contents
fYear
2013
fDate
13-15 June 2013
Firstpage
1
Lastpage
11
Abstract
The following topics are dealt with: interconnect technology; reliability; packaging; 3D integration; electromigration; novel materials and process integration.
Keywords
electromigration; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; three-dimensional integrated circuits; 3D integration; electromigration; interconnect technology; novel materials; packaging; process integration; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference (IITC), 2013 IEEE International
Conference_Location
Kyoto
Print_ISBN
978-1-4799-0438-9
Type
conf
DOI
10.1109/IITC.2013.6615547
Filename
6615547
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