• DocumentCode
    638349
  • Title

    Efficient wireless power transfer system by using highly sub-wavelength negative-index metamaterials

  • Author

    Yingchun Fan ; Long Li

  • Author_Institution
    Xidian Univ., Xi´an, China
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we present a kind of highly sub-wavelength negative refractive index metamaterials for operation at radio frequencies. A dual layer design consisting of planar spiral and meandering line with metallic strips enables the metamaterials with the properties of effective negative permittivity and permeability simultaneously, i.e. negative refractive index. Moreover, its cell size is about 330 times smaller than the resonant wavelength. By applying one or two metamaterial slabs between the two traditional inductive coupling copper rings, the transfer mechanism will be changed to be resonant coupling. Therefore, both of the transfer distance and the transfer efficiency are improved significantly. Full-wave simulation results show that the miniature WPT system with proposed metamterials can work perfectly in improving the transfer efficiency and transfer distance.
  • Keywords
    inductive power transmission; metamaterials; permeability; permittivity; refractive index; WPT system; dual layer design; effective negative permittivity; efficient wireless power transfer system; full-wave simulation; highly subwavelength negative-index metamaterials; inductive coupling copper rings; meandering line; metallic strips; metamaterial slabs; negative refractive index; permeability; planar spiral; radio frequencies; resonant coupling; resonant wavelength; transfer distance; transfer efficiency; transfer mechanism; Copper; Couplings; Magnetic materials; Metamaterials; Refractive index; Slabs; Wireless communication; WPT; metamaterials; miniaturization; negative-index; resonant coupling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Symposium (IWS), 2013 IEEE International
  • Conference_Location
    Beijing
  • Type

    conf

  • DOI
    10.1109/IEEE-IWS.2013.6616714
  • Filename
    6616714