DocumentCode
638729
Title
Thermal degradation and theoretical analysis of amorphous oxide thin-film transistor
Author
Urakawa, S. ; Tomai, S. ; Kasami, Masashi ; Yano, Ken´ichi ; Wang, Dongping ; Furuta, Mamoru ; Kimura, Mizue ; Horita, Masahiro ; Ishikawa, Yozo ; Uraoka, Y.
Author_Institution
Nara Inst. of Sci. & Technol., Nara, Japan
fYear
2013
fDate
2-5 July 2013
Firstpage
125
Lastpage
128
Abstract
We have investigated the thermal distribution of an InSnZnO TFT under various gate and drain voltages by using an infrared imaging system and device simulation. An asymmetrical thermal distribution was observed at a local drain region in a TFT depending on bias stress. These phenomena were decelerated or accelerated with stress time. We proposed the degradation model combining Joule heating and the hot carrier effect. To validate the model, we performed device simulation to obtain the distribution of electric field and Joule heating. From the rapid band bending at drain edge under high drain voltage, we demonstrated the possibility of impact ionization.
Keywords
II-VI semiconductors; amorphous semiconductors; bending; hot carriers; impact ionisation; indium compounds; infrared imaging; semiconductor device models; thin film transistors; tin compounds; wide band gap semiconductors; zinc compounds; InSnZnO; Joule heating; TFT; amorphous oxide thin-film transistor; asymmetrical thermal distribution; bias stress; device simulation; drain edge; drain voltage; electric field distribution; gate voltage; hot carrier effect; impact ionization; infrared imaging system; local drain region; rapid band bending; stress time; theoretical analysis; thermal degradation; Degradation; Electric fields; Logic gates; Resistance heating; Stress; Thin film transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Active-Matrix Flatpanel Displays and Devices (AM-FPD), 2013 Twentieth International Workshop on
Conference_Location
Kyoto
Type
conf
Filename
6617794
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