Inter-layer crosstalk management in differential dual-striplines

Dual-stripline is gaining popularity in computer designs to save printed circuit board (PCB) cost and achieve more compact form factor. A key concern in dual-stripline design is the inter-layer crosstalk (ILC). In this paper, differential dual-stripline crosstalk is investigated, and a complete design strategy is provided. In addition to the conventional crosstalk mitigation techniques, an innovative wiring technique is proposed to reduce ILC for parallel dual-striplines. The proposed routing strategy can effectively mitigate the impact of ILC, and, as a result, enable high-density PCB layout, achieve compact form factor, and save the bill of material (BOM) cost.