• DocumentCode
    649051
  • Title

    Separable beamforming for 3-D synthetic aperture ultrasound imaging

  • Author

    Ming Yang ; Sampson, R. ; Wenisch, Thomas F. ; Chakrabarti, Chaitali

  • Author_Institution
    SECEE, Arizona State Univ., Tempe, AZ, USA
  • fYear
    2013
  • fDate
    16-18 Oct. 2013
  • Firstpage
    207
  • Lastpage
    212
  • Abstract
    Recently, there has been great interest in 3-D ultrasound imaging, but power constraints have precluded practical implementation of high-resolution 3-D ultrasound in handheld imaging platforms. In this paper, we propose a separable beamforming procedure for subaperture-based 3-D synthetic aperture ultrasound systems that drastically reduces computational (and hence power) requirements. Separable beamforming approximates 2-D array beamforming through a series of 1-D beamforming operations. Our proposed method is based on a separable delay decomposition method that minimizes phase error. We show that the proposed separable system achieves 19-fold complexity reduction while producing images with contrast-to-noise ratio comparable to that of non-separable systems. Furthermore, we propose an online iterative delay calculation method that substantially reduces storage requirements. We briefly describe how the separable beamformer can be implemented in the context of Sonic Millip3De, our recently proposed hardware accelerator for the diaital front-end of a 3-D ultrasound system.
  • Keywords
    array signal processing; iterative methods; ultrasonic imaging; 1D beamforming operations; 2D array beamforming; 3D synthetic aperture ultrasound imaging; 3D synthetic aperture ultrasound systems; 3D ultrasound imaging; Sonic Millip3De; complexity reduction; delay decomposition; handheld imaging platforms; online iterative delay calculation; phase error; separable beamforming; 2-D array; Separable beamforming; hardware implementation; separable delay;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Processing Systems (SiPS), 2013 IEEE Workshop on
  • Conference_Location
    Taipei City
  • ISSN
    2162-3562
  • Type

    conf

  • DOI
    10.1109/SiPS.2013.6674506
  • Filename
    6674506