Three-dimensional stacking of silicon chips - An industrial viewpoint

While the semiconductor industry develops into the mature state, growth rates are decreasing and a decreasing percentage of the industry uses the most recent feature sizes of Moore´s law. In parallel, specific smart developments become increasingly important, often summarized as More-than-Moore. 3D integration is one of them. The paper summarizes different 3D technologies and provides details of a specific European project on this subject which uses some of them. Two economically relevant use cases are presented and the challenges and chances of 3D chip stacking are discussed.