• DocumentCode
    65234
  • Title

    Performance of Inversion, Accumulation, and Junctionless Mode n-Type and p-Type Bulk Silicon FinFETs With 3-nm Gate Length

  • Author

    Thirunavukkarasu, Vasanthan ; Yi-Ruei Jhan ; Yan-Bo Liu ; Yung-Chun Wu

  • Author_Institution
    Dept. of Eng. & Syst. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • Volume
    36
  • Issue
    7
  • fYear
    2015
  • fDate
    Jul-15
  • Firstpage
    645
  • Lastpage
    647
  • Abstract
    We investigated the device performance of the optimized 3-nm gate length (LG) bulk silicon FinFET device using 3-D quantum transport device simulation. By keeping source and drain doping constant and by varying only the channel doping, the simulated device is made to operate in three different modes such as inversion (IM) mode, accumulation (AC) mode and junctionless (JL) mode. The excellent electrical characteristics of the 3-nm gate length Si-based bulk FinFET device were investigated. The subthreshold slope values (SS ~ 65 mV/decade) and drain-induced barrier lowering (DIBL <; 17 mV/V) are analyzed in all three IM, AC, and JL modes bulk FinFET with |VTH| ~0.31 V. Furthermore, the threshold voltage (VTH) of the bulk FinFET can be easily tuned by varying the work function. This letter reveals that Moore´s law can continue up to 3-nm nodes.
  • Keywords
    MOSFET; elemental semiconductors; semiconductor doping; silicon; 3-D quantum transport device simulation; Moore´s law; Si; accumulation mode; channel doping; constant source and drain doping; drain-induced barrier lowering; electrical characteristics; gate length; inversion mode; junctionless mode; n-type silicon FinFET; p-type bulk silicon FinFET; size 3 nm; subthreshold slope values; threshold voltage; work function; Doping; FinFETs; Logic gates; Mathematical model; Performance evaluation; Semiconductor process modeling; Silicon; 3-nm Gate Length; 3-nm gate length; 3D TCAD simulation; FinFET; accumulation; inversion; junctionless;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2015.2433303
  • Filename
    7107985