• DocumentCode
    658538
  • Title

    Diagnosing Resistive Open Faults Using Small Delay Fault Simulation

  • Author

    Yamazaki, Kinya ; Tsutsumi, Takuya ; Takahashi, Hiroki ; Higami, Yoshinobu ; Yotsuyanagi, Hiroyuki ; Hashizume, Masaki ; Saluja, Krishan Kumar

  • Author_Institution
    Sch. of Inf. & Commun., Meiji Univ., Tokyo, Japan
  • fYear
    2013
  • fDate
    18-21 Nov. 2013
  • Firstpage
    79
  • Lastpage
    84
  • Abstract
    Modern high performance, high density integrated circuits use a very large number of metal layers, necessitating the need to deal with the problem of resistive open defects. Resistive opens often manifest as and are modeled as small delay faults. Furthermore, in deep sub-micron technologies, it is known that the additional delay of a line with resistive open fault is not only a function of the resistant of the faulty line but it is also dependent on the signal transition(s) on its adjacent lines. In this paper, we propose an efficient simulation method to simulate small delay faults and we use this simulator to diagnose resistive open faults. The fault simulator developed by us simulates all delay faults for one signal line simultaneously. This information is then used to deduce the candidate faulty lines in two steps. Experimental results for ISCAS´89 benchmark circuits show that by using the method proposed by us the faulty lines can be identified correctly in most cases.
  • Keywords
    fault diagnosis; integrated circuit testing; ISCAS´89 benchmark circuit; deep submicron technology; high density integrated circuit; metal layer; resistive open fault; small delay fault simulation; Circuit faults; Computational modeling; Delays; Educational institutions; Fault diagnosis; Integrated circuit modeling; Vectors; fault diagnosis; fault simulation; resistive open faults; small delay faults;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium (ATS), 2013 22nd Asian
  • Conference_Location
    Jiaosi Township
  • ISSN
    1081-7735
  • Type

    conf

  • DOI
    10.1109/ATS.2013.23
  • Filename
    6690619