Mid-bond Interposer Wire Test

Testing the quality of the interposer wires in a 2.5-D stacked IC can avoid the penalty arising from bonding known-good dies to a defective interposer. However, an interposer is particularly hard to test alone due to the lack of a device layer. This paper addresses this problem by proposing amid-bond test method - in which the interposer is tested after each die is attached to the substrate. We borrow the technique of pre-bond test method for the TSV and enhance it by a length-normalization scheme to cope with interposer wires of diverse wire lengths. Simulations show that this mid-bond test method can catch a high percentage of open faults before subsequent dies are attached.