DocumentCode
662326
Title
Experimental verification of coplanar-to-substrate-integrated-waveguide interconnect on low-permittivity substrate
Author
Taringou, Farzaneh ; Bornemann, Jens ; Ke Wu
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Victoria, Victoria, BC, Canada
fYear
2013
fDate
5-8 Nov. 2013
Firstpage
104
Lastpage
106
Abstract
An interconnect between coplanar waveguide (CPW) and substrate integrated waveguide (SIW) is designed and experimentally verified. Common to regular SIW circuits is a low-permittivity substrate, whereas design formulas CPW usually assume a high permittivity. Therefore, commercially available field solvers are used in a parametric study to optimize the interconnect over a wide bandwidth between 18 GHz and 28 GHz. Cross-sectional field plots demonstrate its basic operation. The individual interconnect achieves return and insertion losses better than 20 dB and 0.5 dB, respectively, over the entire frequency range. The respective values for a measured back-to-back transition are 17 dB and 1.45 dB which are in good agreement with simulations.
Keywords
coplanar waveguide components; permittivity; substrate integrated waveguides; CPW; SIW circuits; coplanar-to-substrate-integrated-waveguide interconnect; cross-sectional field plots; insertion losses; low-permittivity substrate; return losses; Coplanar waveguides; Electromagnetic waveguides; Integrated circuit interconnections; Metallization; Microwave amplifiers; Substrates; Waveguide transitions; Integrated circuit interconnections; dielectric substrates; integrated circuit measurements; wideband;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference Proceedings (APMC), 2013 Asia-Pacific
Conference_Location
Seoul
Type
conf
DOI
10.1109/APMC.2013.6695205
Filename
6695205
Link To Document