• DocumentCode
    662699
  • Title

    5-phase interleaved buck converter with gallium nitride transistors

  • Author

    Videau, Nicolas ; Meynard, Thierry ; Bley, Vincent ; Flumian, D. ; Sarraute, Emmanuel ; Fontes, G. ; Brandelero, Julio

  • Author_Institution
    LAPLACE (Lab. Plasma et Conversion d´Energie), Univ. de Toulouse, Toulouse, France
  • fYear
    2013
  • fDate
    27-29 Oct. 2013
  • Firstpage
    190
  • Lastpage
    193
  • Abstract
    More compact power converters can be realized with the recently introduced gallium nitride (GaN) power devices. However, power board layout becomes more critical. In order to reduce switching losses, voltage overshoot and to achieve fast and safe drive, the stray inductances should be minimized. In this paper, a 5-phase DC-DC interleaved buck converter with an InterCell Transformer (ICT) integrated in a multilayer PCB using GaN EPC 100V devices is described. It appears that the routing of power decoupling capacitors is the result of a tradeoff between stray inductance and cooling with a single heatsink for the 5 phases. The power board (110mm×62mm, 51g) reaches 97% efficiency with a 48V to 24V conversion at 1.8kW and an effective output current frequency of 1.5MHz.
  • Keywords
    DC-DC power convertors; III-V semiconductors; cooling; gallium compounds; inductance; power capacitors; power semiconductor devices; wide band gap semiconductors; 5-phase DC-DC interleaved buck converter; GaN; GaN EPC devices; compact power converters; cooling; effective output current frequency; efficiency 97 percent; frequency 1.5 MHz; gallium nitride transistors; heatsink; intercell transformer; multilayer PCB; power 1.8 kW; power board; power decoupling capacitors; stray inductance; voltage 100 V; Gallium nitride; Inductance; Layout; Power electronics; Switching frequency; Switching loss; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wide Bandgap Power Devices and Applications (WiPDA), 2013 IEEE Workshop on
  • Conference_Location
    Columbus, OH
  • Type

    conf

  • DOI
    10.1109/WiPDA.2013.6695594
  • Filename
    6695594